[SCIE]Comparison of the 60Sn40Pb and 62Sn2Ag36Pb Solders for a PV Ribbon Joint in Photovoltaic Modules Using the Thermal Shock Test(2017_04)

제목 : Comparison of the 60Sn40Pb and 62Sn2Ag36Pb Solders for a PV Ribbon Joint in Photovoltaic Modules Using the Thermal Shock Test

저자 : 강민수(1저자), 전유재, 김도석, 신영의 교수(교신)

게재지 : MDPI AG - Energies

In this study, the characteristics of a photovoltaic (PV) ribbon (t = 0.25 mm) joint with 60Sn40Pb and 62Sn2Ag36Pb solders were evaluated using thermal shock tests. The thermal shock tests were performed under three conditions: 40-65 degrees C, 40-85 degrees C, and 40-105 degrees C. The results of these tests were analyzed using electroluminescence (EL) and cross-sectional images. Following testing, broken metal fingers (MFs) were confirmed near the solder joint. PV module degradation was attributed to the broken finger ratio (BFR) based on quantitative analysis of the dark rectangular (DR) regions on the EL images. In addition, the activation energy of the broken MFs was calculated from the increasing BFR. Thermal characteristic variations due to the added Ag in the PV ribbon solder joints were evaluated through observation of solder micro-structure changes following thermal shock tests.