Research paper

[SCIE]Prediction of the Elastic Properties of Ultra High Molecular-Weight Polyethylene Particle-Reinforced Polypropylene Compos

[SCIE}Analysis of Elastic Properties of Polypropylene Composite Materials with Ultra-High Molecular Weight Polyethylene Spheric

[SCIE]Spintronic RF-Direct on-off Keying Modulation Using a Frequency Division Multiplex

[KCI]의료전자기기 적용을 위한 그래핀 나노시트 함량에 따른 Sn58Bi 무연 솔더 접합부의 접합 특성 평가

[KCI]의료전자기기 적용을 위한 Epoxy 솔더 접합부의 신뢰성 평가

[SCIE]Growth of an Ag3Sn Intermetallic Compound Layer Within Photovoltaic Module Ribbon Solder Joints

[SCIE]Bonding Strengths and Thermal Degradation of Photovoltaic Module Ribbon Solder Joints

[SCIE]The Effect of Epoxy Polymer Addition in Sn-Ag-Cu and Sn-Bi Solder Joints

[SCIE]Suppression of the Growth of Intermetallic Compound Layers with the Addition of Graphene Nano-Sheets to an Epoxy Sn-Ag-Cu

[KCI]고온 시효 시험에 따른 Epoxy 솔더 접합부의 접합 특성 평가