Research Focus
Research field
Detailed research areas and business areas
Topic 3: Development of High-Reliability Automotive Semiconductor Bonding Materials
Research Task 1
Solder joint reliability assessment
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Measuring joint strength through shear, tensile, and bending tests
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Analysis of stress concentration and crack initiation due to rapid temperature changes (e.g. -55 ℃ ↔ +125 ℃)
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Evaluation of fatigue crack occurrence due to coefficient of thermal expansion (CTE) mismatch of solder joints in high and low temperature repeated environments
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Comparison with life expectancy prediction models (Coffin-Manson, Engelmaier, etc.)
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Analysis of IMC (Intermetallic Compound) Growth Behavior Using Scanning Electron Microscopy (SEM), TEM, and FIB
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Observation of intermetallic compound layer thickness, crack/void distribution, and grain boundary cracking
Research Task 2
Development of high-performance solder and bonding materials
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Development of bonding materials for eco-friendly electronic products and compliance with RoHS/REACH regulations
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Development of high-temperature solder for automotive and power semiconductor applications, capable of operating at temperatures above 200°C.
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Development and evaluation of nano-reinforced solders
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Development of high-heat dissipation bonding materials (Thermal Interface & High-conductivity Materials)
