{"id":2105,"date":"2025-09-03T23:43:37","date_gmt":"2025-09-03T14:43:37","guid":{"rendered":"https:\/\/mmde.co.kr\/?page_id=2105"},"modified":"2025-09-09T11:20:32","modified_gmt":"2025-09-09T02:20:32","slug":"%ec%82%ac%ec%97%85%eb%b6%84%ec%95%bc-%eb%94%94%ec%9e%90%ec%9d%b8-3","status":"publish","type":"page","link":"https:\/\/mmde.co.kr\/en\/%ec%82%ac%ec%97%85%eb%b6%84%ec%95%bc-%eb%94%94%ec%9e%90%ec%9d%b8-3\/","title":{"rendered":"\uc0ac\uc5c5\ubd84\uc57c \ub514\uc790\uc778 3"},"content":{"rendered":"
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Research Focus<\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Research field<\/h1>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Detailed research areas and business areas<\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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Topic 3: Development of High-Reliability Automotive Semiconductor Bonding Materials<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Research Task 1<\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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Solder joint reliability assessment<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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    \n
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    \n \n Measuring joint strength through shear, tensile, and bending tests <\/span>\n

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    \n \n Analysis of stress concentration and crack initiation due to rapid temperature changes (e.g. -55 \u2103 \u2194 +125 \u2103) <\/span>\n

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    \n \n Evaluation of fatigue crack occurrence due to coefficient of thermal expansion (CTE) mismatch of solder joints in high and low temperature repeated environments <\/span>\n

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    \n \n Comparison with life expectancy prediction models (Coffin-Manson, Engelmaier, etc.) <\/span>\n

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    \n \n Analysis of IMC (Intermetallic Compound) Growth Behavior Using Scanning Electron Microscopy (SEM), TEM, and FIB <\/span>\n

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  • \n\n
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    \n \n Observation of intermetallic compound layer thickness, crack\/void distribution, and grain boundary cracking <\/span>\n

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    \n <\/path><\/svg> <\/div>\n \n <\/div>\n <\/li>\n <\/ul>\n \t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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    Research Task 2<\/span><\/div>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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    Development of high-performance solder and bonding materials<\/h2>\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t
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      \n
    • \n\n
      \n \n \n
      \n \n Development of bonding materials for eco-friendly electronic products and compliance with RoHS\/REACH regulations <\/span>\n

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      \n \n Development of high-temperature solder for automotive and power semiconductor applications, capable of operating at temperatures above 200\u00b0C. <\/span>\n

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      \n \n Development and evaluation of nano-reinforced solders <\/span>\n

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      \n \n Development of high-heat dissipation bonding materials (Thermal Interface & High-conductivity Materials) <\/span>\n

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      \n\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t\"\"\t\t\t\t\t\t\t\t\t\t\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t
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      \n\t\t\t\t\t<\/div>\n\t\t\t\t<\/div>\n\t\t\t\t<\/div>","protected":false},"excerpt":{"rendered":"

      Research Focus \uc5f0\uad6c\ubd84\uc57c \uc138\ubd80 \uc5f0\uad6c\ubd84\uc57c \u00b7 \uc0ac\uc5c5\ubd84\uc57c Topic 3 : \uace0\uc2e0\ub8b0\uc131 \ucc28\ub7c9\uc6a9 \ubc18\ub3c4\uccb4 \uc811\ud569\uc18c\uc7ac \uac1c\ubc1c Research Task 1 \uc194\ub354 \uc811\ud569\ubd80 \uc2e0\ub8b0\uc131 \ud3c9\uac00 […]<\/p>","protected":false},"author":3,"featured_media":0,"parent":0,"menu_order":7,"comment_status":"closed","ping_status":"closed","template":"","meta":{"_acf_changed":false,"footnotes":""},"class_list":["post-2105","page","type-page","status-publish","hentry"],"acf":[],"_links":{"self":[{"href":"https:\/\/mmde.co.kr\/en\/wp-json\/wp\/v2\/pages\/2105","targetHints":{"allow":["GET"]}}],"collection":[{"href":"https:\/\/mmde.co.kr\/en\/wp-json\/wp\/v2\/pages"}],"about":[{"href":"https:\/\/mmde.co.kr\/en\/wp-json\/wp\/v2\/types\/page"}],"author":[{"embeddable":true,"href":"https:\/\/mmde.co.kr\/en\/wp-json\/wp\/v2\/users\/3"}],"replies":[{"embeddable":true,"href":"https:\/\/mmde.co.kr\/en\/wp-json\/wp\/v2\/comments?post=2105"}],"version-history":[{"count":37,"href":"https:\/\/mmde.co.kr\/en\/wp-json\/wp\/v2\/pages\/2105\/revisions"}],"predecessor-version":[{"id":2392,"href":"https:\/\/mmde.co.kr\/en\/wp-json\/wp\/v2\/pages\/2105\/revisions\/2392"}],"wp:attachment":[{"href":"https:\/\/mmde.co.kr\/en\/wp-json\/wp\/v2\/media?parent=2105"}],"curies":[{"name":"wp","href":"https:\/\/api.w.org\/{rel}","templated":true}]}}